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THS4131: Device getting hot

Marvn Arcangel
Genius 10745 points
Part Number: THS4131

Hi Team,

Can you help diagnose the customer issue below?

A customer is testing the device using the schematic from the datasheet (see below). 

In this test, the customer grounded both inputs instead of having a source voltage (a 10V DC source was connected in a different test which resulted in a package temperature of 113C), A 10k value is used for all the resistors, and Vocm pin was connected via a  0.1uF capacitor to ground. the value of Vcc+ was +15V and Vcc- was -15V. The result of this test was a package temperature of 85C which seemed high considering the device is in an idle state.

Could confirm whether this behavior is as expected?

Thank you.

Regards,

Marvin

  • 0
    Guru 48395 points

    The two pieces you need to answer this question are the internal power dissipation and the thermal impedance for the mounting used. Answer those, and you will make a lot of progress. 

  • +1
    Guru 140200 points

    Hi Marvin,

    the OPAmp has to dissipate 30V x 14mA = 0.42W. Times 126°C/W junction-to-ambient thermal resistance for the SOIC package gives a die temperature of 78°C at 25°C ambient temperature.

    Have you thought about using the DGN package with the power pad?

    Kai