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Difference Between SN75ALS176DR and SN65ALS176DR

Hi Team,

 

We received PCN for SN75ALS176DR,  Suggested alternate part is SN65ALS176DR. I have below queries on this;

  1. Is the replacement SN65ALS176DR is Drop-in to SN75ALS176DR?
  2. Please share the difference in comparison table.

 

Thanks!

  • Hi Srikanya,

    1. Yes it is a drop in replacement. 

    2. There are a few minor differences - that shouldn't negatively impact the vast majority of use cases.

    Change Old Value New Value Comment
    Rec. Operating Temperature 0C to 70C -40C to 85C This is an improvement, so no concern here
    RΘJA 110 C/W 116.7 C/W

    Slight increase in junction to ambient thermal resistance - for 1 Watt of power the device will have a 116.7C raise in junction temperature vs. 110C raise in junction temperature - this shouldn't be a major concern in most applications as this value varies greatly with system setup

    Please see app note here for in-depth information on thermal parameters

    RΘJC(top) 44.1 C/W 56.3 C/W Increase in junction to top of case thermal impedance
    RΘJB 53.5 C/W 63.4 C/W Increase in junction to board thermal resistance
    ΨJT 4.8 C/W 8.8 C/W Increase in Junction-to-top characterization parameter
    ΨJB 52.7 C/W 62.6 C/W Junction-to-board characterization parameter
    Typical Performance Curve TX VOH vs. IOH   Similar performance expected but slight difference in curve shape
    Typical Performance Curve TX VOL vs IOL   Similar performance expected but slight difference in curve shape
    Typical Performance Curve VOD vs IO   Similar performance expected but slight difference in curve shape
    Typical Performance Curve RX VOH vs. IOH   Similar performance expected but slight difference in curve shape
    Typical Performance Curve RX VO vs VEN I   Similar performance expected but slight difference in curve shape
    Typical Performance Curve RX VO vs VEN II   Similar performance expected but slight difference in curve shape
    Typical Performance Curve RX VOL vs IOL    Similar performance expected but slight difference in curve shape

    There are few minor differences - but barring any extreme edge cases - the device is a drop in replacement and should be able to meet the needs of the application/ use case that the older device was filling. The largest differences are the thermal parameters - but these values vary quite a bit system to system so please see the app note that i linked in the comment on the thermal impedances in the table above to help determine if these value changes will impact the system - in most systems these slight increases don't much much of a difference - and considering that the application used a lower temperature rated part the concern is minimal. 

    Please let me know if you have any other questions!

    Best,

    Parker Dodson