INA2132: Thermal data

The junction-to-case and junction-to-board thermal resistance is specified only for IC packages with thermal pads.  Since INA2132UA uses a standard SO-14 package with no thermal pad, only a junction-to-ambient thermal resistance is specified - see below.

In a conduction cooled system, with negligible convection to the environment, what is the recommended calculation for the temperature then?

My conduction cooled model will have the board temperature, but not an easy way to estimate the ambient temperature since the system is enclosed and subject to a range of environments. 

Hi Claudia,

how are you cooling the printed circuit board then?

Kai

Claudia,

Even if we could provide you with junction-to-case thermal resistance for INA2132, a board temperature is not equal to the case temperature in the packages with no thermal pad.  My advice would be to try to use a temp sensor to measure ambient temperature inside the system enclosure, which may be easier said than done.  

As I mentioned, the system is conduction cooled. So the PWB would also be cooled via conduction. 

Okay I'll see what test data they can dig up. Does TI have any reliability data on the part that specifies temp/power/etc vs MTBF (or similar parameters)?