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LMH6654: Thermal Resistance Info

Part Number: LMH6654

Could you please provide me with junction to board and junction to case thermal resistance values for this component?

  • Hello John,

    I can work on getting those values for you; in order to begin, could you tell me the package-type you are interested in using in your design?

    For the LMH6654, these are:

    SOIC (D)

    SOT-23 (DBV)

    Thank you.

    Best,

    Alec

  • Hi Alec,

    John included this request in CSC but no information found from our database. He is requesting the thermal information for SOT-23 (DBV).

    • LMH6654MF/NOPB

    73,
    Archie A.

  • Hello Archie,

    Fantastic, thank you for sharing!  I will get right to work on this; once I have an expected timeline, I will update you.  The general basic timeline for these requests is two weeks.

    Best,

    Alec

  • Hello John, Archie,

    The thermal modelling request has been submitted and I will update you accordingly.

    If you have additional questions on the LMH6654, you may ask in the interim.

    Best,

    Alec

  • Hello John, Archie,

    For the LMH6654MF/NOPB the thermal characteristics are as follows:

    Result- Theta JA-High K (standard datasheet value) 169.9 °C/W
    Result-Theta JC, top (standard datasheet value) 74.7 °C/W
    Result-Theta JB (standard datasheet value) 38.5 °C/W
    Result- Psi JT (standard datasheet value) 10.7 °C/W
    Result- Psi JB (standard datasheet value) 38.2 °C/W
    Result-Theta JC, bottom (standard datasheet value) n/a

    These values only apply to the OPN above (LMH6654MF/NOPB) in SOT-23 (DBV) package.

    Best,

    Alec