Could you please provide me with junction to board and junction to case thermal resistance values for this component?
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Could you please provide me with junction to board and junction to case thermal resistance values for this component?
Hello John,
I can work on getting those values for you; in order to begin, could you tell me the package-type you are interested in using in your design?
For the LMH6654, these are:
SOIC (D)
SOT-23 (DBV)
Thank you.
Best,
Alec
Hi Alec,
John included this request in CSC but no information found from our database. He is requesting the thermal information for SOT-23 (DBV).
73,
Archie A.
Hello Archie,
Fantastic, thank you for sharing! I will get right to work on this; once I have an expected timeline, I will update you. The general basic timeline for these requests is two weeks.
Best,
Alec
Hello John, Archie,
The thermal modelling request has been submitted and I will update you accordingly.
If you have additional questions on the LMH6654, you may ask in the interim.
Best,
Alec
Hello John, Archie,
For the LMH6654MF/NOPB the thermal characteristics are as follows:
These values only apply to the OPN above (LMH6654MF/NOPB) in SOT-23 (DBV) package.
Best,
Alec