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PGA204: Recommended rework procedure

Shinu.V.Mathew
Expert 7875 points
Part Number: PGA204

Hi Team,

For critical shipments customer is planning to remove PGA204AU from old design pcb's and re-solder in new boards.

 As the part is moisture sensitive, can you please share the recommended rework procedure for PGA204AU. Customer have a temperature limitation of 80 Deg for  baking because of the other components on the board.

Regards, S Mathew

  • 0
    TI__Expert 7875 points

    As this is a MSD having level 3 and it was already assembled on the product 

    1. What is the min temp and time required for baking the component. ( as this on product, this can be kept for baking only at 80 degree C considering the safety of other components)
    2. Which is the suitable process to remove the component from already assembled board- Hot air or manual using soldering iron.
    3. What is the max temp that can be applied during hot air removal ( normally we follow 245 degree C for 60-90 sec)  or manual soldering iron ( normally 300 to 350 degree C).
    4. How many thermal cycles above 200 degree C can be applied on this component.

    Thanks. 

  • 0 in reply to Shinu.V.Mathew
    TI__Genius 10285 points

    Hi S Mathew,

    1.) From to the Handling and Process Recommendations document, the bake times are specified for 125°C, 90°C, and 40°C, where temperatures 90°C or less must be humidity controlled to <5%RH. You may use the 90°C specification with some additional time added to the bake to make up for the slightly lower temperature.

    As you can see from Table 5, the bake time can be greatly decreased if the higher temperature is used. If you are able to safely remove the 80°C limited components before the bake, that would be recommended. Do the 80°C components have MSL limitations?

    2.) The recommended rework procedure is detailed in the Handling and Process Recommendations document. Ensure that the Lead temperature does not exceed the absolute maximum rating of 300°C for 10 seconds as specified in the PGA204 datasheet.

    3.) The MSL Ratings and Reflow Profiles document specifies the recommended reflow profile. Note that the peak temperature (250°C) should not exceed 30 seconds. 

    4.) The IC packages are classified according to J-STD-020 and withstand three reflow cycles.

    Regards,

    Zach

  • 0 in reply to Zach Olson
    TI__Expert 7875 points

    Thanks Zach,

    Thanks for your valuable inputs.