INA240: MTBF/FIT

Yuto Hori

Part Number: INA240

I received a question about MTBF/FIT about INA240A1PWR from customer. Could you answer the below question?

When reflow soldering or hand soldering this device, does the value of MTBF/FIT change depending on the soldering temperature and number of reflow?
What are the MTBF and FIT values in the table below for the reflow temperature and number of reflow cycles?(Or, are these values obtained when the IC is not mounted on the board and no heat is applied?)

ti.com/quality-reliability-packaging-download/report?opn=INA240A1PWR
Is it possible to receive information on TI's recommended reflow temperature profile and number of reflow cycles?

Background of question
Reflow temperature changes when customer changes the mounting plant. They also repair by soldering if errors occurs. Customer would like to know whether the value of MTBF/FIT changes significantly or not in such case.

over 1 year ago

0 Javier Contreras4 over 1 year ago

TI__Mastermind 29870 points

Hello Yuto,

1) I am sure the MTBF/FIT rate changes should change based on the additional stress to the device. The amount I do not know and need to investigate if we have some information. I am sure the information would be just an overall explanation of additional stress causes an increase in stress. I did find this. https://www.ti.com/support-quality/reliability/temperature-change-FIT.html?keyMatch=MTBF

2)During qualification some stresses had the device go through preconditioning. https://www.ti.com/support-quality/faqs/qualification-summary-faqs.html

3. Here is some reflow information. https://www.ti.com/lit/an/spraby1a/spraby1a.pdf: Keep in mind we do have have an automotive version with more qualification standards.

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INA240: MTBF/FIT