OPA2277: Need confirmation on notification released from TI for an Quality Issue. - MPN : OPA2277UA/2K5

manoj balakrishnan

Part Number: OPA2277

Hi Experts ,

Can you please check and confirm the attached notification from TI for potential lifted bond pad .

We are having a stock of 705 pcs of MPN : OPA2277UA/2K5 and tell us any need to return the parts back against this notification released from TI .

Also please send me the list of MPN applicable for this particular notification .

Looking forward to your support on this matter to move further steps on it .

Thank you..

Regards

Manoj Balakrishnan.

0 Luis Chioye over 1 year ago

Hi Manoj,

Thank you for your interest of the OPA2277.

I have sent you a direct email, connecting you directly with the Amplifier's team, to provide direct support with this matter.

We will continue the discussion/support with further steps via direct email.

Thank you,

Kind Regards,

Luis

0 manoj balakrishnan over 1 year ago in reply to Luis Chioye

Thanks Luis . I have replied to that mail chain. Awaiting for the reply from concern team.

0 Michael Hartshorne over 1 year ago in reply to manoj balakrishnan

Manoj,

We received your email and responded, we will continue any correspondence over email.

Regards,
Mike

0 manoj balakrishnan over 1 year ago in reply to Michael Hartshorne

Thanks for your support

0 manoj balakrishnan over 1 year ago in reply to Michael Hartshorne

Thanks for your support

0 Michael Hartshorne over 1 year ago in reply to manoj balakrishnan

Hi Manoj,

Sure thing, I'll close this post, please let us know if there is any more questions though.

Regards,
Mike

0 manoj balakrishnan over 1 year ago in reply to Michael Hartshorne

Thanks for your valuable support.

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