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THS3001: Thermal data for THS3001HVDGN package

steve smith1
Intellectual 280 points
Part Number: THS3001
Other Parts Discussed in Thread: THS3491

Hi I see from the datasheet that the DGN package has only 4.7 Degrees C/W thermal resistance to case. Is this the resistance to the thermal slug ? Also does anyone have the thermal resistance to PCB so that I can make an apples-apples comparison with the THS3491 ? I'm needing similar or better thermal performance to minimize long-term settling. Thanks

  • 0
    TI__Genius 17671 points

    Hello Steve,

    I am submitting a request for thermal modelling on the THS3001IDGN.  The usual turn-around time is within two-weeks as the thermal modelling team is centralized.  As a general method, I request the thermal characterization parameters in addition to specifically requested thermal values.

    Best,

    Alec

  • +1 in reply to Alec Saebeler
    TI__Genius 17671 points

    Hello Steve,

    Please find below the requested thermal modeling values for THS3001DGN:

    Theta JA 56.9
    Theta JC, top (standard datasheet value) 78.2
    Theta JB (standard datasheet value) 29.6
    Psi JT (standard datasheet value) 4.7
    Psi JB (standard datasheet value) 29.5
    Theta JC, bottom (standard datasheet value) 12.5

    The units are in °C/W.  The Semiconductor IC & Package Thermal Metrics document discusses common assumptions and potential improvements to using the thermal modelling parameters.

    Best,

    Alec