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LMP2012QML-SP: Lid grounded?

Gregory Duperon
Expert 6540 points
Part Number: LMP2012QML-SP

For OPN 5962L0620601VZA

Is the lid metal and floating?

  • 0
    TI__Guru 62790 points

    Gregory,

    10-Lead CLGA is a ceramic package with bottom exposed metal that should be solder to PCB in order to minimize junction-to-case (ϴjc) thermal resistance to 12.3C/W - see below.  Without it, junction-to-air (ϴja) thermal resistance would be much higher - 175C/W for still air and 115C/W for min air flow as difined below.  The bottom metal is floating but for optimal thermal performance and structural integrity it typically should be soldered to PCB ground plane.

    NAC0010A package.pdf

  • 0 in reply to Marek Lis
    TI__Expert 8995 points

    Hi Gregory,

    The lid is ceramic material, and yes it is floating.

    A quick correction to Marek's comments... this device is actually in the CFP package and is mislabeled as CLGA in the datasheet. Sorry for the confusion, there is no bottom exposed metal in the CFP package and this device does not have a thermal pad. We will work on revising this in the datasheet.

    Thanks,

    Zach