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LMP7704-SP: What is the thermal tail settling behavior of this amplifier?

Part Number: LMP7704-SP
Other Parts Discussed in Thread: INA129, LMP7704, LMP2012QML-SP

Hello,

What is the thermal tail settling behavior of LMP7704-SP?

Thanks

  • Ekam,

    The response for this device is the same as what I gave you for the INA129.  Let me know if you have additional questions:

    1. I think by "Thermal tail settling behavior" you are referring to the offset settling on power up.  Is this what you mean?
    2. The thermal power-up characteristics of the device will depend on the load.  For minimal load, the offset of the device should settle in microseconds. 
    3. A load step change in operation will cause self-heating of the device.  This will also cause a shift in offset which will take some number of microseconds to settle to.
    4. This behavior is not characterized for most precision devices as the settling is in the microseconds and typically not a concern in most applications.
    5. If you have a concern regarding this behavior you will have to give me more details regarding your specific conditions.

    Best regards,

    Art Kay

  • Hhm, the datasheet of LMP7704-SP doesn't specifiy any settling at all.

    Kai

  • The national teams were not super interested in fine scale settling performance. 

  • Typically, we only show output setting in response to a step input voltage (see below for LMP7704) including settling time to 0.1%, 0.01% and sometimes 0.0015% (16 bits) - missing here as Kai pointed out..

    As far as the thermal tail settling behavior goes, this would require characterization involving multi-dimensional matrix of change in the output voltage and/or load (power dissipation) for each type of package with different thermal resistance characteristics and for this reason it is seldom done. The best thermal settling time behavior would be obtained by using one of our zero-drift parts like LMP2012QML-SP (dual).