• State
  • Locked Locked
  • Replies 1 reply
  • Subscribers 48 subscribers
  • Views 189 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

Follow up question for the failure analysis on OPA376AQDBVRQ1

Gibong Son
Prodigy 10 points

I recently asked IC(OPA376AQDBVRQ1) failure analysis(FA) to TI and received detailed FA. 

The related TI QEM Event# is QEM-CCR-2303-01068. 

The FA result is that pin 1,2,5 are shorted. Electrical overstress(EOS) is suspected based on EIPD on the die. 

I contacted the field quality engineer(Michal Paugh:paugh_mike@ti.com) to ask follow-up questions, but he told me to ask the questions here. 

Below shows the one picture in the FA, and have some questions. 

  1. What is the damaged area? Is it pin 5or another pin? How can we relate this damage in the picture below to the short circuit in Pin 1, 2, and 5?
  2. Could you specify what current or voltage level damages the area(absolute max stress)?  

Please let me know. 

Sincerely, 

Gibong

  • 0
    TI__Genius 13385 points

    Hi Gibong,

    We'll have to discuss with our design team here.  I'm going to ask that we communicate over email, sorry that you directed here and now going back to email.  I will connect with Mike and get back to you shortly.

    Also, I'm going to delete the image of the layout above per our disclosure rules.

    Regards,
    Mike