LM2904B: Cross reference for NJM2904M.

Kengo.Y

Part Number: LM2904B

Hi team,

I'd like to confirm that the NJM2904M can be replaced.to LM2904BIDR.
I am wondering if the njm package is a bit larger and can be implemented in the same land.
However, the cross reference says it is "Drop in replacement".

BR.
Kengo.

over 1 year ago

0 Clemens Ladisch over 1 year ago

Guru 287370 points

JRC's "DMP8" package is wider than SOIC (so the cross-reference tool is not strictly correct), and does not appear to match any standard. SOIC (D) or SOP (PS) might fit on the footprint, depending on the actual length of the footprint pads.

0 Kengo.Y over 1 year ago in reply to Clemens Ladisch

Guru 10745 points

Hi Clemens,

Thank you.

>Hi TI team,
Could you give me some advice?

BR.
Kengo.

+1 Gerasimos Madalvanos over 1 year ago in reply to Kengo.Y

TI__Mastermind 29156 points

Hey Kengo,

The lead pitch is the same, you may be able to use a longer pad footprint. Similar in concept to the following article.

https://www.ti.com/lit/an/slyt744/slyt744.pdf

Looking at the two package drawings and calculating from origin, the land pattern for the NJM device starts 2.415mm from the center of the device and ends 3.685mm from the center of the device. For TI, the land pattern starts at 1.925mm from the center of the device and ends 3.475mm from the center of the device.

This means there is some overlap on the land patterns of the two devices, so it may work, but you may get continuity problems if the placement of the device is off.

Here are the two package drawings for comparison:

TI SOIC 8: https://www.ti.com/lit/ml/msoi002k/msoi002k.pdf

NJM DMP 8: https://www.nisshinbo-microdevices.co.jp/en/pdf/package/dmp8.pdf

Best,
Jerry

Amplifiers

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LM2904B: Cross reference for NJM2904M.