• State TI Thinks Resolved
  • Locked Locked
  • Replies 1 reply
  • Answers 1 answer
  • Subscribers 46 subscribers
  • Views 289 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TLV3801: thermal pad to VEE

Adam Daluga
Expert 6055 points
Part Number: TLV3801

Hello,

We’re using the TLV3801 in the WSON (DSG0008B) package. The package has a thermal pad but the datasheet does not indicate how to connect it electrically.

 

The eval board shows the thermal pad connected to VEE, but I’m wondering if it’s connected to VEE internally, or if it’s just floating copper?

Thanks,
Adam

  • 0
    TI__Guru 53946 points

    Hello Adam,

    Unless otherwise specified, we recommend to tie it to VEE (the lowest potential voltage).

    The die mounting compound is conductive, so the pad is connected to the bottom of the die. The bottom of the die is essentially the "ground plane" of the die.

    The pad is not directly connected to anything other than the bottom of the die. The main VEE path is the VEE pin.

    Tying the pad to a voltage other than VEE could cause the bottom of the die to be at a higher potential than VEE, which is not good. Leakages could occur.

    Letting it float could act as a noise entry path, both coupling internal noise across the die (like a floating PCB copper plane), as well as external noise. Floating would also possibly let the bottom of the die float to a random voltage - which is not good.

    So I would recommend tying it to VEE.