Dear All,
I need an information about package of 5962R1920601VXC: from datasheet is not clear if the thermal pad on bottom side is present or not.
The datasheet showes both solution but I'm not able to find any indication.
Can you help me about this issue?
Thanks in advance for your gently reply.
Best Regards
Stefano
Hi Stefano,
The LMP7704-SP does have a thermal pad (backside metallization).
You may refer to the CFB (HBH) package outline for the up-to-date package information.
Regards,
Zach
Hi Stefano,
Based on the date stamp It looks like the drawing without the thermal pad is from an older revision of the datasheet. It looks like the package drawings were updated last year to correctly show the thermal pad. For some reason the older drawing was not removed.
Thanks for your feedback, we will address this on the next update to the datasheet. Please let me know if you need further support on your LMP7704-SP design.
Best,
Zach
