I needed power dissipation value for TLV7011DCKR. Also what is the solder reflow profile for the following part.
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I needed power dissipation value for TLV7011DCKR. Also what is the solder reflow profile for the following part.
Hello Avpreet,
The TLV7011 is a low power device. The total dissipation will depend on the output loading.
The maximum quiescent current is 10uA and max supply is 5V.
So 5V * 10uA = 50uW dissipation.
For soldering, TI qualifies to the J-STD-020D standard.
Solder reflow profile is 260 °C. This is listed in the product folder, datasheet ordering table and packing labels.
Hi Paul, Per datasheet for TLV7011DCKR I see that Max Vcc is 6V and in recommended it's 5.5 but for test conditions they've specified 5V. What should be the reading that i'll need to consider as recommended ?
Hello Avpreet,
5V or 5.5V, whichever you prefer. It really does not make a big difference in the overall operation of the device. The recommended operating conditions table is actually a range of 1.65 to 5.5V, so 5V is within that range.
The specs in the electrical table are at 5V, so I'd just use 5V.