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THS4541: Difference between packages

Kei Kuwahara
Expert 5970 points
Part Number: THS4541

Hello team,

I see there are VQFN and WQFN package option for THS4541.

What are the difference between those packages besides thermal resistance? Any benefit for chosing VQFN, which is a bigger size?

Best Regards,
Kei Kuwahara

  • +1
    TI__Genius 11000 points

    Hi Kei,

    Like you mentioned the biggest difference between the two device packages are their thermal performance due to the thermal pad on the VQFN package. Overall, there isn't much difference between the two devices performance wise, however the VQFN does have a more favorable pin configuration as it has feedback pins close to its inputs which virtually eliminates any trace length in the feedback path. The WQFN does line up the outputs and their required inputs to the same side to help limit the trace length. Good layout practices like the ones highlighted in the Layout section of the datasheet will result in a well performing device regardless of package but special considerations for designs with board size constraints or heat dissipation concerns are the main reasons why someone would prefer one package over the other.

    Best Regards,

    Ignacio