Hi,
We have submitted a PCN to our customer regarding OPA858 wire bonding change (Au→Cu).
Therefore, we have the following inquiries.
The customer uses this part as a very high speed TIA and is concerned about the impact of the change.
I don't think there will be any problems since the parasitic components are the same, but Cu is harder than Au and is likely to oxidize more easily.Will this be a problem when used as a TIA?
thank you for your support.
Hiroshi
