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LMC6464: Terminal Process Data

Hung Vo
Prodigy 30 points
Part Number: LMC6464

Hello,

For the

LMC6464AIMX/NOPB

Please provide

What is the termination finish [pure Sn, matte Sn]?

What is the Plating Process [Electroplate, Immersion, Hot dip, other]?

What is the Plate Thickness (micro‐inches) [<50, 50‐250, 250‐500, 500‐1000, >1000 micro‐inches]?

What is the material under plate [Brass/Bronze/BeCu, Copper, Ferrous, Nickel]?

What is the substrate controlling the Coefficient of thermal expansion (CTE) source [Cu or Al, Ceramic, Ferrous, Low expansion alloy]?

What is the Plating Heating [Fused, Annealed or None]?

 

Thanks,

Hung Vo

Upcoming PTO:

Electronics Technology Department

Raytheon Company

408-666-0072

  • 0
    TI__Genius 10675 points

    Hi Hung,

    Here is the information I could find on the LMC6464AIMX/NOPB leadframe.

    Leadframe Plating: No Plating - Non Rough

    Leadframe Base Metal: Cu

    Lead Finish: Sn

    For more information, you may refer to the "Material Content" information that is available under the "Quality, Reliability, & Packaging" page.

    Here a direct link to the report for LMC6484AIMX/NOPB: https://www.ti.com/quality-reliability-packaging-download/report?opn=LMC6464AIMX/NOPB 

    Please let me know if you have any further questions.

    Regards,

    Zach

  • 0
    Prodigy 30 points

    Hi Zach,

    How about:

    What is the Plate Thickness (micro‐inches) [<50, 50‐250, 250‐500, 500‐1000, >1000 micro‐inches]?

    This is the pure Sn finish thickness. This info is not available from the material content and is required for my whiskering analysis for the device.

    Please help!

    Thanks,

    Hung

  • 0 in reply to Hung Vo
    TI__Genius 10675 points

    Hi Hung,

    I can provide this guidance from TI's Quality page regarding lead finishes and tin whiskers: https://www.ti.com/support-quality/environmental-info/lead-finish-tin-plating.html 

    Hopefully this is sufficient for your analysis.

    Unfortunately, this along with the information from my previous reply is the only detailed assembly information that we can disclose on the public forums. If your company has an active NDA with us, it is possible that we can discuss this more in private, however I'm still not sure how much of our assembly process we are able to disclose.

    Regards,

    Zach