LMC6464: Terminal Process Data

Hung Vo

Prodigy 30 points

Part Number: LMC6464

Hello,

For the

LMC6464AIMX/NOPB

Please provide

What is the termination finish [pure Sn, matte Sn]?

What is the Plating Process [Electroplate, Immersion, Hot dip, other]?

What is the Plate Thickness (micro‐inches) [<50, 50‐250, 250‐500, 500‐1000, >1000 micro‐inches]?

What is the material under plate [Brass/Bronze/BeCu, Copper, Ferrous, Nickel]?

What is the substrate controlling the Coefficient of thermal expansion (CTE) source [Cu or Al, Ceramic, Ferrous, Low expansion alloy]?

What is the Plating Heating [Fused, Annealed or None]?

Thanks,

Hung Vo

Upcoming PTO:

Electronics Technology Department

Raytheon Company

408-666-0072

11 months ago

0 Zach Olson 11 months ago

TI__Genius 10235 points

Hi Hung,

Here is the information I could find on the LMC6464AIMX/NOPB leadframe.

Leadframe Plating: No Plating - Non Rough

Leadframe Base Metal: Cu

Lead Finish: Sn

For more information, you may refer to the "Material Content" information that is available under the "Quality, Reliability, & Packaging" page.

Here a direct link to the report for LMC6484AIMX/NOPB: https://www.ti.com/quality-reliability-packaging-download/report?opn=LMC6464AIMX/NOPB

Please let me know if you have any further questions.

Regards,

Zach

0 Hung Vo 11 months ago

Prodigy 30 points

Hi Zach,

How about:

What is the Plate Thickness (micro‐inches) [<50, 50‐250, 250‐500, 500‐1000, >1000 micro‐inches]?

This is the pure Sn finish thickness. This info is not available from the material content and is required for my whiskering analysis for the device.

Please help!

Thanks,

Hung

0 Zach Olson 11 months ago in reply to Hung Vo

TI__Genius 10235 points

Hi Hung,

I can provide this guidance from TI's Quality page regarding lead finishes and tin whiskers: https://www.ti.com/support-quality/environmental-info/lead-finish-tin-plating.html

Hopefully this is sufficient for your analysis.

Unfortunately, this along with the information from my previous reply is the only detailed assembly information that we can disclose on the public forums. If your company has an active NDA with us, it is possible that we can discuss this more in private, however I'm still not sure how much of our assembly process we are able to disclose.

Regards,

Zach

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LMC6464: Terminal Process Data