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LM224A: Risk for immersion cooling analyzement

Erick Hong
Prodigy 150 points
Part Number: LM224A

Tool/software:

Hello experts, 

I am Erick, sales in Taiwan, I would like to kindly request for your help with analyze or give me any feedback if there could be any risk to put LM224ADR in immersion cooling.

The immersion cooling process is soaking the server in a non-conductive liquid, conducting heat through direct contact with the hot part and the flow of the liquid, eliminates the need for dissipating the heat part.

The below information may help you to analyze the impact putting device in  the selective immersion cooling.

  1. Immersion cooling process, 
    https://2crsi.com/immersion-cooling
  2. The solution our customer use is Noah 3000, which is consist of 100% Perfluorononene epoxides
  • 0
    TI__Mastermind 29076 points

    Hello Erick,

    I am waiting a response from our internal packaging expert and will update this thread when I have a response. I appreciate your patience with this request.

    Best,
    Jerry

  • 0 in reply to Gerasimos Madalvanos
    TI__Prodigy 150 points

    Hello Jerry, 

    OK, really thanks for your help, I'll wait for the packaging experts and feel free to let me know if have any advice, thank you.

  • 0 in reply to Erick Hong
    TI__Mastermind 29076 points

    Hello Erick,

    Could you please provide which customer this is for?

    Best,
    Jerry

  • 0 in reply to Gerasimos Madalvanos
    TI__Mastermind 29076 points

    Hello Erick,

    We have qualified our components to industry standards of JEDE47C. We can offer to support customer with having them run a system level test and after they have completed it, we can do a Physical failure analysis (PFA) study on any interaction with the TI device, however I do not believe there should be issues with fresh, clean solution.

    While TI has not studied them our customers have bought such products from TI and our competitors who use same semiconductor materials and assembly processing. What seems to be known in the industry is that that direct immersion cooling per se does not have obvious ‘no go’ failure mechanisms for semiconductor type products. There are instances where the liquid can interact and cause degradation of things like marking readability (IMO not a careabout in the field) but no special / new wear out mechanism for this environment.

    What seems to be ok is that fresh solution seems to be compatible with active electronic components but with time, the liquid potentially gets contaminated with chemical which leach out from different system components. If the customer is refreshing that cooling liquid then that may address that concern.

    Best,
    Jerry