TL052: The different performance of two assembly location for TL052IDR

Yang He

Part Number: TL052
Other Parts Discussed in Thread: TL072H,

Tool/software:

Hi team

This is the sales for SCHNEIDER China, and my customer has received two batches of TL052IDR, which are from Mexico and Malaysia Assembly location.

The problem is they test their board and found the power consumption of 16*TL052IDR is 250mA which are from Mexico Assembly location, but the total power consumption of 16*TL052IDR is 187mA which are from Malaysia Assembly location.

So they wanna know whether are there some different impact between Mexico and Malaysia assembly location. The attachment is the label.

over 1 year ago

0 Clemens Ladisch over 1 year ago

Guru 318050 points

Devices from the RFB fab indeed are different; see PCN# 20221216011.1. The guaranteed datasheet limits have not changed, but the new die has typical characteristics similar to the CMOS TL072H device.

0 Yang He over 1 year ago in reply to Clemens Ladisch

TI__Prodigy 60 points

What's the typical characteristics, that will affect what's performance just like the above power consumption?

And this performance has been confirmed when the PCN changed?

0 Ron Michallick over 1 year ago in reply to Yang He

TI__Guru**** 166236 points

Hello Yang,

Clemens Ladisch said:
similar to the CMOS TL072H device.

Not TL072H device.

Typical current is 4.6mA per TL052 data sheet. The decreased current is (250mA - 187mA) = 63mA or 4mA per TL052. The PCN change actually lowered typical current by a similar amount. There is no minimum limit for ICC in the data sheet.

Other bonuses are VOL, VOH, IIB improved. Slew rate may be faster or slower depending on signal level and circuit gain. All performance within limits of current data sheet.

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TL052: The different performance of two assembly location for TL052IDR