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LM7372: Tin Whisker Mitigation Solutions

Part Number: LM7372
Other Parts Discussed in Thread: OPA2891

Tool/software:

Hi,

I'm interested in TI's custom solutions to mitigate tin whiskers for PBF parts.

Does TI support the following, and if so, I'd like to request a dedicated cost factor against each supported method:

  1. Strip/Replate
  2. Matte/Low-Stress Tin Finish
  3. Vary Tin Plating Thickness
  4. Reflow of Pure Tin-Plated Surfaces
  5. Annealing

Once again, this question is meant to evaluate all PBF parts. If cost factor varies per part, what variables influence it?

Thanks,
Rashad Alsaffar
Design/Development Engineer
CPI-EDB

  • The LM7372 uses "Matte Sn" lead finish.

    ti.com/support-quality/environmental-info/lead-finish-tin-plating.html says:

    As a whisker mitigation measure, TI

    • Anneals Matte Sn post plated leadframe-based packages with formed leads for 1 hour at 150° C within 24 hours of plating. This is the industry-accepted method for controlling whisker growth.
    • Maintains the minimum “as plated” thickness is 7 μm, with 15% of thinning allowed after lead trim and form for electro-Plated devices. This thickness conforms to the recognized Tin Whisker Mitigation practices published in JEDEC/IPC JP002.

    More modern devices like the OPA2891/2 have NiPdAu lead finish.