TLV3202: Baking Condition for TLV3202AIDR

The MSL Ratings and Reflow Profiles application report says:

Products that exceed their floor life can be re-worked with a bake to drive out residual moisture. The Reference Conditions for Drying Mounted or Unmounted SMD Packages table in IPC/JEDEC J-STD-033C provides guidance about the baking procedure and where you should take care to ensure that the plastic housing (trays, tape and reel or tubes) can withstand the temperatures being considered.