Tool/software:
Hello team,
We are in need of information on the UBM (Under Ball Metallization)/SRO (Solder Resist Opening) of this device TLV9062SIYCKR.
We need this for our DFM team to define their own land pattern.


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Tool/software:
Hello team,
We are in need of information on the UBM (Under Ball Metallization)/SRO (Solder Resist Opening) of this device TLV9062SIYCKR.
We need this for our DFM team to define their own land pattern.


Hi Austin,
I will work with our internal teams to see if this is something we can provide.
Is there a reason why we cannot use the Ultra Librarian footprint here?

Thanks,
Jacob