Part Number: LM324
Tool/software:
Hi Team,
Customer ask for the humidity reliability of LM324N/LM324DR, do we have a report about this requirement? I cannot find any information in the datasheet. Thanks in advance.
BTW, Is there a quick method to determine humidity reliability?
BRs,
Francis
Hi Francis,
Customer ask for the humidity reliability of LM324N/LM324DR, do we have a report about this requirement?
The LM324DR is encapsulated with MSL=1 molding compound, which means this is the best epoxy molding material in the encapsulant class, see the link below.
https://www.ti.com/lit/an/snoa550h/snoa550h.pdf?ts=1732583575708
The relevant material information can be found in the link below.
https://www.ti.com/materialcontent/en/report?pcid=24846&opn=LM324DR
- Operating humidity: 40 °C 95% RH 192H
- Storage humidity: 40 °C 95% RH 96H
BTW, Is there a quick method to determine humidity reliability?
The storage humidity figures are outside of recommended storage conditions. If this is for testing purposes, it will be acceptable.
Per operating humidity figures - 40C@95%RH for 192 hours (8 days) are acceptable if it is for testing purposes. I assumed that the operating conditions are for non-condensing humidity testing environment. If the test is conducted in moisture condensing environment, it is recommended to coat ICs with water proof or resist conformal coating to act as moisture barrier - this is the standard technique for the application.
The temperature/moisture tests are acceptable for the application. It has no humidity reliability risks per the tests. However, the DUT after the tests should be thoroughly dried in air or in an oven, if the customer is concerned about the potential short-circuit conditions within the DUT (localized moisture could built-up within cracks or low spots within the DUT + dust and foreign objects). If the PCB is fully conformal coated, these may not be a concern.
I am not certain what do you mean by humidity reliability? Moisture absorption is a reversible physical phenomena. If it is fully dried, the moisture absorption (if any) within the molding compound will be restored to pre-tested level. There is no damage to the IC itself, since MSL=1 is low water absorption molding compound (mainly surface water absorption after the temperater/humidty tests and will be dried off readily).
If the customer concerned about the water absorption, they can weight the IC before and after the temperature/humidity tests. The difference in weight indicates the level of moisture absorption in the part. However, you need to standardize such measurement and allow time to air out the surface moisture. Otherwise, the weight figures are not going to be consistent from parts to parts.
If you have other questions, please let me know.
Best,
Raymond
HVA Application Team
