TL331: Country & Location of Fab

Hi Eugene,

Please reference this application note for details about this device: Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions

-Can i know where is the Fab Site for this Lot? China or USA

I ran the lot and the die for the device is the JI3 die (China).

-And is there any die size different between Fab Site China and USA

Yes.

Regards,

Ho

Hello Eugene,

These high volume devices are assembled in multiple sites in multiple countries.There are multiple possible assembly sites and subcons.

You will need to look at the packing label to determine the assembly site.

The die will come from either USA (Ji1 and TiB)  or China (Ji3).

Not all sites are using the same die - so you cannot determine die from just assembly sites or datecodes.

Please see sections 3.4 and 3.5, and table 3-1 of the above mentioned appnote.

The 20L through 23L fields of the packaging label will tell you where the die was fab'ed and where the device was assembled.

20L = CSO = Chip Site Origin (The fab name = RFB, SHE or CU3)

21L = CCO = Chip Country of Origin (country the die was fabricated - USA or CHN)

22L = ASO = Assembly Site of Origin (The name of the assembly site - multiple worldwide sites)

23L = ACO = Assembly Country of Origin (The country the device was tested and assembled - multiple worldwide sites).

When ordering from distributors, or TI.com, they will get whatever is on the shelf - so they could get one of three die options from multiple sites.

If a specific die or assembly site is required, you will have to work with internal TI sales to request specific lots.