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OPA4170: OPA4170AIPWR

Tracy Ouyang
Prodigy 40 points
Part Number: OPA4170

Tool/software:

HI

kindly check below photo and confirm which are the components belong to? You can chose A, B, C,D,E, or F.
Kindly confirm back to me with today, thanks a lot.

  • 0
    Guru 283350 points

    A

    There is no such integration trend in general; the increased manufacturing cost makes this economical only for some high-proced applications (desktop/server CPUs, mobile phones).

  • 0
    TI__Guru 56971 points

    Hi Tracy, 

    Clemens is correct that the ICs have not reached this level of integration for low cost components. 

     OPA4170 belong A category, and it can be integrated with sensors, which some of TI products have these features. I think that this is more futuristic integration block diagram.

    In hybrid IC process, MCO integration can be achieved, but it can only achieve some of above integration. 3D integration is challenge for hybrid technology. TSMC, Samsung and Intel, memory and other semi manufactures can do 3D integration and design,  but it is still limited in certain products. To have the above integration for wide range of applications, semi-manufactures have to master all these IC process and design technologies, and integrate these ICs in a single substrate will be difficult. If one is buying all the individual IC and put them together in hybrid IC, this is possible. However,  it won't be low cost IC for the mass market. 

    If you have other questions, please let us know. 

    Best,

    Raymond