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TLV1704-SEP: Theta JC bottom

Andrea Bordonali
Prodigy 190 points
Part Number: TLV1704-SEP


Tool/software:

Hello,

I am looking for the parameter ThetaJC_bottom.  The datasheet has Theta_JB, but I will be using a thermal interface material between the bottom of the component to the board to improve heat transfer.  Is this information available?

Thanks,

Andrea

  • 0
    TI__Guru 62806 points

    Hello Andrea,

    The ThetaJc-bottom is usually used for the devices that have bottom thermal pads. We do not model ThetaJC_bottom for all packages.

    The bottoms of these packages usually do not touch the board, so it would basically be the same as the ThetaJc_top as most of the heat is going out of the leads and there is little internal self-heating (these are low power devices).

    Please see the following appnote - this is written by the folks that do the modeling and explains the parameters:

     http://www.ti.com/lit/pdf/spra953