AMC1211-Q1: PD Qualification result for DWV package

Hi Junichi,

I will check with my team on this question and get back to you.

Best regards,

Eva

Hi Junichi,

Can you please give more background on the information you are looking for? Please let me know, thank you.

Best regards,

Eva

Sorry for my mistake. The customer is asking for information on Pb Free SD evaluation, not PD.

The customer is asking about the SD reliability result of this product, specifically the solderability >95% lead coverage. Is this similar to the evaluation results of the product using SnPbAg (control) and SnAgCu (Pb-free) solder paste as described in TI's application report (SZZA026–July 2001)?

They'd like to know the material information, especially if the Pb Free paste material is different from this report.

Thank you.

Hi Junichi,

Thank you for clarifying, I am following up with my team on this. 

Best regards,

Eva

Eva -san, 

Thank you for your supporting.

So, do you have any update info?

Thanks again and best regards,

J.Komura.

Hi Junichi,

Can I contact you offline and send you the answer over email? Please let me know, thank you.

Best regards,

Eva

Eva -san

Thanks for your reply.

Yes, I have no problem replying by email. Thank you in advance.

Best regards,

J.Komura