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OP07: OP07CDR current consumption

eiji osugi
Prodigy 10 points

Part Number: OP07

Tool/software:

What is the variation in current consumption?
When replacing the OP07CDR with a different lot, the current consumption of the part will go from 5mA to 2mA.
Is it really that variable?
This is the result of only replacing the parts, without changing the input or output.


Vcc+-: 17V
VIN: 0V

  • 0
    TI__Guru* 77501 points

    Hi Eiji-san,

    eiji osugi said:
    What is the variation in current consumption?

    I assumed that you are aware of FAB changes in the product line, see the thread below. 

    https://www.mouser.com/PCN/Texas_Instruments_PCN20231031008_20231031213947123.pdf

    https://www.mouser.com/PCN/Texas_Instruments_PCN20230327006_20230330181435151.pdf

    eiji osugi said:
    Is it really that variable?

    I know that RFAB typically has lower Iq than SFAB due to its smaller Si-die design. I am not aware of CFAB's Iq figure. Less quiescent current in op amp is a desirable feature, which means that the quiescent power on the op amp is less and reduced. 

    The quiescent current will not affect the performance of the op amp's functionality. They are equivalent. So this is NOT a variable in terms of the op amp's functionality. 

    Some customer is using the Iq to detect the a system's operational states (rare). If that is the case, the current detection threshold needs to be modified. Within the same process, the Iq is fairly consistent. The variations are exhibited among different FAB process. When the op amp with old process is depleted in inventory, the final product will be manufactured from RFAB process. 

    Currently, the op amps with RFAB and CFAB being sold by the TI's distributors or TI E-store,  

    If you have additional questions, please let me know. 

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    Prodigy 10 points

    Hello Raymond,

    Thank you for the information.

    I also received the document titled "PCN20231031008_20231031213947123.pdf" that was attached by the manufacturer.

    Upon reviewing it, I found that the current consumption of the parts was reduced by half when comparing the components received before and after the change, using the same circuit. I would like to confirm whether this observation is correct.

    The manufacturer stated that there were no changes in functionality, and I am currently checking with TI to understand the reason for this difference.

    Thank you for your response.

  • 0 in reply to eiji osugi
    TI__Guru* 77501 points

    Hi Eiji-san,

    eiji osugi said:
    Upon reviewing it, I found that the current consumption of the parts was reduced by half when comparing the components received before and after the change, using the same circuit. I would like to confirm whether this observation is correct.

    Yes, the observation is expected due to the last FAB change, where Si-die is smaller than the previous FAB process. 

    eiji osugi said:
    The manufacturer stated that there were no changes in functionality, and I am currently checking with TI to understand the reason for this difference.

    Yes, the functionality has not changed in the part per the new FAB. When a FAB is changed, there will be some differences, but these changes should fall within the the min. and/or max. ranges specified in the datasheet. You may check if the interested key parameters have changed  in the op amp via testing, which is a standard practice in Japan. 

    If you have other questions, please let me know. 

    Best,

    Raymond