TLV9352-Q1: ESD rate and FIT rate

Hi Taku-san, 

Taku Murayama said:

Could you tell me the for ESD(Surge during mounting process

rate) and FIT rate TLV9352QDRQ1?

During machine mounting process such as pick and place, tape & reel handling (unwinding, separation), parts traveling in carrier trays and reflow soldering process etc., electrostatic charges may be accumulated and/or transferred to the op amps' pins and package. So proper ESD controls in these machine need to be addressed, where ESD charges needs to be dissipated before the reflow process. 

The TLV9352QDRQ1 incorporates internal ESD protection circuitry to safeguard against ESD events during handling and assembly; the device is designed with robust ESD protection mechanisms. But this protection alone is inadequate to prevent the ESD damage, and the entire mounting and reflow process have to be handled properly and minimize the ESD surge in the manufacturing process. 

TI offers MTBF and FIT estimates, which are based on extensive reliability testing and ongoing monitoring. You can find these estimated figures in the link below. 

https://www.ti.com/quality/docs/estimator.tsp?opn=TLV9352QDRQ1&cpn=&partNumber=TLV9352QDRQ1#resultstable

If you have other questions, please let me know. 

Best,

Raymond