TLV3603: Reflow Profile

Kentaro.Kori

Prodigy 25 points

Part Number: TLV3603

Tool/software:

What should I refer to for the temperature conditions when implementing the TLV3603DCKR?

I am looking for documents that provide the following information:

- Temperature profile during reflow

- Temperature conditions during flow

- Temperature conditions during hand soldering

3 months ago

+1 Paul Grohe 3 months ago

TI__Guru 60426 points

Hello Kentaro,

Please see the following application notes:

MSL Ratings and Reflow Profiles (Rev. A)

Handling & Process Recommendations (PDF, 324 KB)

Absolute Maximum Ratings for Soldering (PDF, 5.4 MB)

When in doubt, follow JEDEC J-STD-020 standard.

0 Kentaro.Kori 3 months ago in reply to Paul Grohe

Prodigy 25 points

Thank you for your response and for providing the recommended application notes and standards. I will review the documents you mentioned. Best regards, Kentaro

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TLV3603: Reflow Profile