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OPA2209: Delamination of Component

Sin Yee Lee
Prodigy 55 points
Part Number: OPA2209

Tool/software:

Hi 

Our end customer reported that they found a delamination issue on this mounted component. They have shared the test report with us, but it is in Chinese.

They are using this component in an oil and gas application. Is there any limitation that the part is not recommended use in such environments?

Thank You

Sin Yee

  • 0
    TI__Guru* 77081 points

    Hi Sin Yee,

    Sin Yee Lee said:
    Is there any limitation that the part is not recommended use in such environments?

    Could you send me the delamination report in Chines? I can take a look.

    Molding compound is based on cured epoxy resin. If a PCB with electronics is soaked in water based coolant, for instance, the delamination over time is not a surprise. If the PCB is soaked in oil- based coolant, the delamination will be slower, but it depends on the type of oil coolant. Anyway, I do not what the customer did, but I may be able to provide suggestion to overcome some of the issues, if I take a look at the report. 

    Best,

    Raymond

  • 0 in reply to Raymond Zhang1
    Prodigy 55 points

    Hi Raymond

    Thanks for the prompt response. 

    How can I share you the test report? 

    Do you have any email i can send to? 

  • 0 in reply to Sin Yee Lee
    TI__Guru* 77081 points

    Hi Sin Yee, 

    Please post a "friendship" request via E2E and we can establish a private communication. Once the communication is established, we can discuss the matter in private. 

    Best,

    Raymond