Tool/software:
Hi TI Support Team,
I would like to request your assistance and clarification regarding a recent issue observed on the LF412CDR operational amplifier.
We are encountering FCT self-test failures on product affecting 11/11 PCAs. After troubleshooting, we isolated the root cause corresponds to TI's LF412CDR.
A-B-A Swap Test Results
-
DC 2446: Consistently failed FCT.
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DC 2241: Passed all tests when swapped into the same location.
Voltage Measurement Comparison at U41
| Pin | New DC 2446 (V) | Old DC 2241 (V) |
|---|---|---|
| 1 | 11.0 | -1.1 |
| 2 | 6.0 | 3.75 |
| 3 | 0.0 | 3.79 |
| 4 | -12.0 | -12.0 |
| 5 | GND | GND |
| 6 | 0.0 | 0.0 |
| 7 | 4.0 | 4.0 |
| 8 | 12.0 | 12.0 |
Failure Observed
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The new DC 2446 parts fail during calibrator functional testing.
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The affected device has MPN: LF412CDR.
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The good device (DC 2241) has MPN: LF412CDRG4.
Suspected Root Cause
Based on X-ray imaging and PCN 20221216011.1, we suspect that die-level changes due to fab transition (e.g., wafer size change from 150 mm to 300 mm) may have introduced subtle differences:
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New fab site uses different die and bond wire material (Cu 0.96/0.8 mil).
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No electrical spec change was indicated in the PCN.
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However, functional discrepancies are clearly observed.
- PCN mentions datasheet update, but the latest publicly available datasheet still shows August 1994 as the last revision (only package info updated).
Request for Clarification
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Can TI confirm whether any internal spec, design, or electrical behavior has changed post-PCN 20221216011.1?
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Should we expect a new version of the datasheet, or is the current (1994) version still applicable to the new die?
Appreciate urgent feedback
Thank you in advance for your support.
