Tool/software:
We are considering the use of your electronic components and are conducting a preliminary risk assessment to ensure there are no issues in our production flow. We would appreciate it if you could provide answers to the following inquiries:
#1. Our reflow oven uses VPS reflow (vapor phase soldering). Is it possible to implement using VPS reflow?
#2. Could you please provide us with the reflow implementation conditions (temperature/time)?
#3. Regarding cleaning conditions, we will conduct immersion cleaning in a cleaning tank using a semi-aqueous cleaning solution set at a liquid temperature of 80°C.
Are there any issues with the semi-aqueous cleaning solution/liquid temperature of 80°C/immersion cleaning?
#4. We will conduct baking in a vacuum drying oven. Is baking at 40°C in a vacuum environment (100 Pa) possible?
#5. If a vacuum environment is not feasible, we will conduct baking in a regular drying oven that is not in a vacuum environment. What is the storage temperature (TSTG) for the components?
#6. There may be cases where hand washing with a brush is necessary. Is it possible to clean with toluene and ethanol?
