OPA2391: Wafer availability

John Bell

Part Number: OPA2391

Tool/software:

Hi TI,

We are working on a project that involves smart contact lenses. We would like to use the OPA2391YBJR amplifiers for sensor control but they nned to be thin!

American Semiconductor from Boise Idaho has the ability to thin entire wafers down to below 100 microns thick for placement on flexible circuits.

Would it possible for us to purchase 2 or more whole wafers (maybe 200mm diameter?) from TI, preferably without any BGAs (Ball Gird Arrays) attached, as we would have to remove them.

Thanks in advance,

John Bell PhD

1 month ago

0 Marek Lis 1 month ago

TI__Guru 67891 points

John,

OPA2391 is a package-level trimmed part. What it means is that its offset and temperature drift is adjusted AFTER being packaged. Therefore, even if TI agrees to sell you whole wafers, the dies would be untrimmed resulting in vastly higher input offset voltage and drift than specified in its datasheet.

0 John Bell 1 month ago in reply to Marek Lis

Prodigy 10 points

Thanks Marek, I really appreciate the fast and specific response:)

0 Marek Lis 1 month ago in reply to John Bell

TI__Guru 67891 points

Glad to help even though this does not solve your dilemma.

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OPA2391: Wafer availability