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TLV3012: Packaging information

Part Number: TLV3012

Hi Team,

Hope  this email finds you well.

Our customer has purchased the part TLV3012AIDBVR.
PO No:029-D3091 
Customer comments below:
However, as per the datasheet, the part is classified as MSL Level 2.
As per MSL-2 packaging it is expected the parts to be received in MBB bags.
The received parts were supplied with an ESD cover.

The parts in our stock were received in the same packaging as customer received.

Kindly advise on this concern.

With warm regards,
Swafa.KA

 

  • Hello Swafa,

    What MSL level does the box LABEL show?

    Different assembly sites can have different MSL levels. There is a mix of MSL1 and MSL2 depending on assembly site for this device.

    The MSL level shown on-line and the datasheet will be the WORST CASE of the available MSL levels, which would be MSL2.

    When in doubt, trust the BOX LABEL value.

    MSL1 is shipped without the ESD bag.

    See page 20 of the "Semiconductor Packing Methodology" appnote:

    https://www.ti.com/lit/pdf/SZZA021

    Please send a picture of the label, or, provide the datecode or lot# to confirm.

  • Hello Paul,
    Good day.

    Thanks for your message & prompt support.

    Please find the image of the packaging below:

    ...

    The box label in the datasheet mentions the MSL level 2.
    The received packaging is of MSL1.

    Customer requires a document related to the same.

    Please review and advise.

    With warm regards,
    Swafa.KA

  • Hello Paul,

    Apologies,

    I find some error in attaching the image of the packaging.
    Please find the Date Code & Lot code below:
    Date code:2430+5 
    Lot Code:4465532PHI 

    Please feel free to ask further if you have any questions.

    With warm regards,
    Swafa.KA

  • Hello Paul,

    Good day.

    Could you please confirm if the received part TLV3012AIDBVR. in ESD cover nags are acceptable?

    Date code:2430+5 
    Lot Code:4465532PHI 

    Please advise.

    With warm regards,
    Swafa.KA

  • Hello Swafa,

    This lot is MSL1, which DOES NOT require the ESD bag.

    I looked at the ATSS for this device and it does NOT contain the bag ("dry packaging").

    Relevant document:

    See pages 20 and 21 of the "Semiconductor Packing Methodology" appnote:

    https://www.ti.com/lit/pdf/SZZA021

    The contents are correct.

  • Hello Paul,

    Thanks for the detailed information & support.

    Have a nice week.

    With warm regards,
    Swafa.KA