Part Number: TLE2064
We have TLE2064IDR devices failing our In-Circuit (ICT) test and I believe it has to do with changes to the die and/or bond wires related to a PCN. The failing devices have the following markings: Top-side = TI51CKJ5K and TLE2064I; Bottom-side = KCP01 and KCQ01
Can you tell me how to read the date codes for the TLE2064IDR devices?
Also, the PCN from December 5, 2023 PCN# 20231130004.1 states that there is no anticipated form, fit or function changes. With the die being changed and the bond wire diameter changing from 0.96mil to 0.8mil, I don't see how there wouldn't be electrical characteristic changes. Obviously, our ICT system detected a change.