LM2904: Inquiry About Lead-Frame and Die-Size Differences Among LM2904QDRQ1 Lots

jun Li

Part Number: LM2904

Hi,

I recently performed X-Ray inspections on different lots of TI part number LM2904QDRQ1. Devices from three distinct date codes show obvious differences in both lead-frame geometry and die size:

Lead-frame structures vary slightly (e.g., lead pitch, internal bonding style).
Die dimensions are not identical; some lots have noticeably smaller dies.
Exterior packages look normal; after decap, one unit displayed TI markings, confirming it is genuine.

Could you please advise:

Are these lead-frame and die-size variations within the scope of normal manufacturing changes?
Has any Product Change Notification (PCN) been issued for these modifications?

Thank you!

28 days ago

0 jun Li 28 days ago

Prodigy 50 points

Just to clarify, I have only decapped one unit so far.

0 Carrie 27 days ago in reply to jun Li

TI__Intellectual 2230 points

Hi Jun Li,

This device did go through a change, the details of which can be found in the PCN HERE. Note the changes include the design and bill of materials, which is why the die size and leadframe are varied. Please let me know if you have further questions.

Best regards,
Carrie

0 jun Li 25 days ago in reply to Carrie

Prodigy 50 points

Hi Carrie,

Thank you for your response and for pointing out the PCN.

Could you confirm that I show you the internal structures for this product LM2904QDRQ1 are all correct?

Thank you.

Best regards,

Jun Li

0 Carrie 24 days ago in reply to jun Li

TI__Intellectual 2230 points

Hi Jun Li,

Yes, the internal structures look correct. If you'd like, you can share the top side markings and I can trace the device internally.

Best regards,
Carrie

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LM2904: Inquiry About Lead-Frame and Die-Size Differences Among LM2904QDRQ1 Lots