For the following devices:
TPS1H200AQDGNRQ1
TPS7A5601RTER
SN65CML100DGKG4
SN65LVDS100DGK
TPS22953DQCR
REF3325AIDBZRG4
TXS0108EDGSR
TPS3435CAKAGDDFRQ1
TXS0102DCUR
TPS3435CAKAGDDFRQ1
I would like to know the following wafer fabrication information:
1. Initial Release Date and Latest revision (or the last revision in which the part design suffered changes).
2. the minimum feature size (Distance between the elements that make up the structures on a chip, commonly known as wafer node, tech node or feature size). The size of the features are measured in nanometers. A 22 nm process technology refers to features 22 nm or 0.022 µm in size. Also called a "technology node" and "process node," early chips were measured in micrometers.
3. the process technology used (Semiconductor technology, example: bipolar, MOSFET, CMOS, etc.)
