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OPA547: TI PCN 20251105000

Part Number: OPA547
Other Parts Discussed in Thread: INA168

Hello I am currently assessing changes detailed in TI PCN 20251105000.  I noted the qual device found in the report was INA168QDBVRQ1 or a SOT-23-5 package type.  

I was hoping to inherit qualification data pertaining to the OPA547F for the package TO-263 (DDPAK-7).  Is that available currently?

Thanks,

frank.meola@baesystems.us

  • Hey Frank, 

    Thanks for reaching out. 

    I was able to find information on this PCN number. This PCN included devices using the JIBB process in our Sherman fab. This change included a fab site change (Sherman fab offload) and fab material change (wafer diameter change from 150mm to 200mm)

    Due to this transfer to a new fab site, we used a qualification device (INA168QDBVRQ1) to validate that no shift existed between pre and post PCN fabrication. 

    Important information to consider:

    The device process and design have remained entirely unchanged

    The assembly test site for material has remained the same

     

    Since INA168 passed the qualification effort, we were able to qualify other devices using the JIBB process. This means that OPA547FKTWT does not have qualification data pertaining to this PCN, as there was no observed change on the qualification driver (INA168QDBVRQ1).

    It is important to consider that final test data is always used to ensure we maintain the expected performance detailed in the datasheet. 

    Please let me know if you have any questions on this information. 

    Thanks,

    Jacob

  • Thank you for clearing up matters here I'll archive your comments and push details into our system.  Thank you Jacob greatly appreciated!

  • No problem, feel free to reach out if anything else comes up!

    Thanks!

    Jacob