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ISO224EVM: baking inspection of the MSL component

Babu Mucharla
Prodigy 210 points
Part Number: ISO224EVM


Dear sir/mam,
 
We have been using your devices in many of our designs for various applications. In the process of Baking the MSL level component, we have encountered a problem as below;
 
"During the process of baking the MSD component at +125 °C in a chamber for 48 hours, the chamber door was opened in the middle of the 48 hours duration (around 44th hour) to introduce a tray consisting of PCBs into the same chamber which also needed the same baking temperature of +125 °C for 4 to 6 hours duration."
 
 
So, we have a few queries related to the above process.
 
  1. Can we open the chamber door in between the baking duration - to add another batch of MSD components for shorter duration or even longer duration or to add PCBs, etc.
     
  2.  What is the effect on the component which is undergoing baking when the chamber door is opened before the completion of baking duration.
     
  3.  Do we need to extend the baking duration if the chamber door is opened in between the baking process.
     
  4. Do we need to repeat the baking for the complete 48 hours duration.
 
Please suggest/recommend us further course of action need to be taken to resolve the above said issue.
 
 
Thanking you and looking forward to hear from you soon.
  • 0
    TI__Guru**** 182021 points

    Hi Babu,

    Sorry for the delay.  It is recomended to keep the chamber closed for the specified bake time.  The entire bake cycle may need to be restarted according to IPC/JEDEC J-STD-033 standards to ensure proper drying.  Can I ask what this has to do with the ISO224EVM though?

  • 0 in reply to Tom Hendrick
    Prodigy 210 points

    Hi Tom Hendrick,

    Thankyou for reply.

    While creating the issue part number was not showed so, I created the case with ISO224EVM.

    We need your recommendation particular to our case to proceed further. Should we repeat entire process or any specific process is there?

  • 0 in reply to Babu Mucharla
    TI__Guru**** 182021 points

    It is best to follow the recommended IPC/JEDEC J-STD-033 standards.  I don't know how long you left the oven door opened to insert the new PCB's or the environmental conditions of your lab, so it is difficult for me to provide guidance other than what is shown in the various standards.

  • 0 in reply to Tom Hendrick
    Prodigy 210 points

    1. The chamber door was opened for few seconds to <1min to insert another batch of components or PCBs.

    2. If extended baking is required, how many hours do we need to extend, if we open the chamber door <1 minute during the baking cycle.?
  • 0 in reply to Babu Mucharla
    TI__Guru**** 182021 points
    If a Moisture Sensitive Level (MSL) bake is interrupted, the procedure outlined in the JEDEC J-STD-033 standard must be followed:
    • Interruption of 15 minutes or less: The interruption time is generally considered negligible, and the bake can resume without adding the interruption duration to the total bake time.
    • Interruption greater than 15 minutes but less than 1 hour: The total time of the interruption should be excluded from the original bake time, and the device should be baked for the remaining necessary duration to ensure the minimum total bake time is achieved. For example, if a 24-hour bake is interrupted for 45 minutes, the total time in the oven would be 24 hours and 45 minutes.
    • Interruption greater than 1 hour: The bake should be restarted for a full 24 hours (or the full specified time). 
  • 0 in reply to Tom Hendrick
    Prodigy 210 points

    1. With the interruption, is there any chance of device damage?

  • 0 in reply to Babu Mucharla
    TI__Guru**** 182021 points

    There would not be any functional damage to the device.