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XTR200: Thermal Pad connected to internal GND

Rosario Gandolfo
Intellectual 2850 points

Part Number: XTR200

Hi team,

I have a question regarding the XTR200.
I see that this part has a thermal pad for better thermal distribution.
The recomendation here is to connect this thermal pad to GND, but I would like to understand if this pad is already connected to GND inside the package internally?
Furthermore, would a copper surface on the circuit board that does not have a GND connection be sufficient (since according to the data sheet the pad has only thermal and mechanical properties anyway)? 

Best regards,
Rosario




  • 0
    TI__Mastermind 24272 points

    Hello Rosario, 

    I will ask internally.

    Could you tell me more about the copper surface of the circuit board? If it is not GND, what is the potential? 
    Do you have a schematic you could share? Do you know what your expected output will be (current or voltage mode) and the load value? 

    All the best,
    Carolina 

  • 0 in reply to Caro Gomez
    TI__Intellectual 2850 points

    Hi Carolina,

    thank you for this quick feedback.

    I will need to check what can be provided.
    In the mean time can you perhaps say, if the thermal pad is connected to GND inside the chip?
    This would already be helpful to understand.

    Best regards,
    Rosario 

  • +1 in reply to Rosario Gandolfo
    TI__Mastermind 19050 points

    Hi Rosario, 

    The thermal pad is connected to ground internally. The GND pin (pin 9) itself must be connected as this connection is not low resistivity. The thermal pad can be connected to ground or left floating. 

    Please see the layout recommendations, especially for improvements to power dissipation. As Caro mentioned in her previous post, a schematic or output information would be helpful to understand what considerations would need to be taken into account. 

    Regards,
    Ashley