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LMH6642: Heat dissipation solution

Danilo A.
Mastermind 31080 points
Part Number: LMH6642


Hi Team,

Posting on behalf of our customer.

This is regarding LMH6642 component with SOT-23 package.
We are using 128 of these components in a 2 layer board. 
PFA photo for your reference.
Spacing from component to component is 12 mm vertically and 4.5mm horizontally.
We are facing difficulty in dissipating the heat of these components. 
In our thermal analysis the temperatures are going upto 150Degrees, which is very high.
Will the component's ceramic package help in dissipating heat?
Seeking your help in suggesting a solution/way through which we can dissipate the heat of the component.

Regards,

Danilo

  • 0
    TI__Mastermind 18195 points

    Hi Danilo,

    I have a few questions that would help clear stuff up. Is there a schematic that the customer can share? Any additional images of the components being used will also be good as the image that was shared does not show the components. I was also curious about the behavior the customer is seeing. Does the circuit get hot just with the device on? Meaning without driving anything the device is getting this hot? Regarding thermals we don't really deal with layouts with this many devices however considering this device does not have a thermal pad has the customer tried using a large fan? There is likely a limit in what the customer can do from a layout perspective other than making the board bigger and adding more copper to spread out heat. I believe a fan setup would be worth trying to quickly see if the customer is seeing any difference in its behavior. I would like to see the circuit just to rule out any potential stability concerns with the circuit as this could cause significant heat dissipation.

    Best Regards,

    Ignacio