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LM2904-Q1: P2P PKG device

Part Number: LM2904-Q1

Hello,

Do TI has pin to pin / same package alternative device for BA2904YFVM-M and BA2904YFVM-C? 

regards,

  • Hey Ryo,

    TI does have a pin to pin alternative to BA2904YFVM-M and BA2904YFVM-C.

    The FVM suffix indicates that this is a MSOP8 package. TI VSSOP8 has the same pinout with minor differences in body/pin dimensions. It is recommended to do a dual footprint layout to accommodate both packages. The VSSOP8 pad's are larger requiring expanded bond pads.

    Rohm MSOP8

    • Body Size is 2.9mm x 2.8mm
    • Pin1 to Pin8 is 4mm
    • Distance between center of pins is 0.65mm
    • Land width is 0.35mm

    TI VSSOP8

    • Body Size is 3mm x 3mm
    • Pin1 to Pin8 is 4.9mm
    • Distance between center of pins is 0.65mm
    • Land width is 0.45mm

    TI VSSOP8 in red and Rohm MSOP8 in blue. Would this solution suffice?

    LM2904BQDGKRQ1 would be the correct drop in alternative for BA2904YFVM.

    I would encourage you to check out Tim's "Second-sourcing options for small-package amplifiers" to fully grasp this concept.

    Please do let us know in case of further questions or concerns.

    Best,

    Jack Snyder

    Product Marketing Engineer

    TI High Voltage Amplifiers