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TPA6120A2: TPA6120A2 EVM

Part Number: TPA6120A2
Other Parts Discussed in Thread: , , PGA2311

Hi Team,

I’m currently using the TPA6120A2 in the DWP package and following the peripheral circuitry from the TPA6120A2EVM. Due to PCB size constraints, I’m planning to switch to the smaller package version using the TPA6120A2RGYEVM.

I have a few questions:

  1. Are there any differences in the default peripheral circuitry between TPA6120A2EVM (DWP) and TPA6120A2RGYEVM (RGY) that affect functionality or performance?

  2. Is the default gain configuration the same on both EVMs, or does it differ due to package/layout changes?

  3. My input is single-ended and comes from a PGA2311. Will the gain and overall behavior remain the same if I migrate from the DWP-based EVM design to the RGY-based EVM design?

  4. Does the package change (DWP vs RGY) have any practical impact on audio performance, stability, or noise, assuming the recommended layout and components are followed?

I’ve already validated the design with the DWP package and just want to be sure there’s no hidden difference when moving to the smaller package.

Best regards,

Falguni

  • Hi Falguni,

    You should see no major performance difference between the two packages. Other than thermal performance differences, everything should be the same. I would add that the thermal values are very close to each other so I would not expect to see major differences from a thermal perspective either. In terms of differences between EVMs, they both come in a gain of 2V/V however some of their resistor values differ. With current feedback devices, this will affect the bandwidth of the device so you will see slight differences between the EVMs from that perspective. But once again, if both are setup the same (same resistor network) you should see similar results between both packages.

    We do have user's guides (attached below) for both EVMs so you can compare the differences between the two.

    TPA6120A2RGYEVM User's Guide

    TPA6120A2 EVM

    Best Regards,

    Ignacio

  • But in both the EVM's resistor values are different.I have to use resistor values as per EVM's guide of both the IC ?
    Also if i place thermal vias under the IC will this be a better approach towards better thermal performance.

  • Hi,

    If you characterized the device with 1k resistors and liked the performance I would use the RGY package in the same configuration. The difference in resistors between the two EVMs was a matter of choice not so much a requirement for the device to function. As for vias for the thermal package, you should use vias on the thermal pad for both devices. Placing four or five vias on the thermal pad will ensure you get optimal thermal performance. In both user's guides, we have layout images where we add these vias.

    Best Regards,

    Ignacio