Part Number: OPA209
Dear TI support team,
We have recently received a shipment of OPA209 wafer (device: 10209PEAIMX) under lot number 0759565. To proceed with our wafer dicing process, we require the digital x-y die location map file (preferably in .xml, .map or . dat format).
At present, we have only received the wafer map file in PDF format, which does not allow us to proceed with automated processing. We would greatly appreciate your assistance in directing us to the appropriate contact person at TI who can support this request.
Best regards,
Stephen