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LF412QML: Glue LF412 MD8 die using a conductive epoxy on a metal sheet

Danilo A.
Mastermind 34345 points

Part Number: LF412QML
Other Parts Discussed in Thread: LF412

Hi Team,

Posting on behalf of our customer.

I'll share this E2E post with our customer so he can reply when needed.

Customer inquired if they can glue LF412 MD8 using a conductive epoxy on a metal sheet.

Regards,

Danilo

  • 0
    TI__Expert 6550 points

    Hi Danilo,

    We generally do not recommend using a conductive epoxy, especially if connecting it to a metal sheet. Below is a table comparing using a non-conductive epoxy vs. a conductive epoxy. Using a non-conductive epoxy and a flip chip bonding method is generally lower risk.

    Feature
    Non-Conductive Epoxy
    Conductive Epoxy
    Primary Use
    Mechanical/Thermal
    Electrical & Mechanical
    Electrical Isolation
    Yes
    No
    Shorting Risk
    Low
    Very High
    Reliability
    High
    Lower
    Process Complexity
    Lower
    Higher
    Bonding Method
    Flip-Chip
    Direct Connection (Rare)

    Ultimately, the implementation of the LF412 is at the user's discretion. We recommend thorough testing and validation in your specific application.

    Best,
    Carrie

  • 0
    Prodigy 40 points

    Hi Carrie,


    Thank you for your prompt response. The “metal sheet” in the post was intended to be the op-amp’s gold bonding pad. I bear full responsibility for not getting my ideas across during the call. In any case, the pad is part of a thick film hybrid layout. Looking forward, validation of LF412 performance is the next step in our process.

    Tom C

  • 0 in reply to Tom Campbell
    TI__Expert 6550 points

    Hi Tom,

    Thanks for the clarification! You can use a conductive epoxy, but this method generally carries more risk for corrosion and shorting if applied improperly. You can also use a flip chip connection method. This decision really depends on many applications factors, as well as resources available.

    Best,
    Carrie

  • 0 in reply to Carrie
    Prodigy 40 points

    Thanks Carrie.  

    Let me reframe my original question.  We're going to mount the die to a gold pad on our thick film hybrid with conductive epoxy.  We can tie this pad to ground, the positive supply rail, or the negative rail. Which of these is preferred?

    Best,

    Tom

  • 0 in reply to Tom Campbell
    TI__Expert 6550 points

    Hi Tom,

    For this scenario, I would tie the pad to ground or the negative supply. Is the op amp in a dual or single supply configuration? If in a single supply operation, I would recommend tying it to ground, but if in a dual supply configuration, I would tie it to V-.

    Best,
    Carrie

  • 0 in reply to Carrie
    Prodigy 40 points

    Thanks Carrie.  We're running dual supplies.  So, we'll tie the pad to V-.

  • 0 in reply to Tom Campbell
    TI__Expert 6550 points

    Hi Tom,

    Sounds good! Let me know if you have any other questions.

    Best,
    Carrie

  • 0 in reply to Carrie
    Prodigy 40 points

    Thanks Carrie.

    Best.

    Tom