TLV9101: Copper expose on the leadframe cutting edge

The TLV9101 is not sold in a 10-pin package.

Assuming this is some other device like the TLV9102‍SIRUGR, this is normal. The sides are not plated and are not expected to form a solder fillet. Some automotive devices use an additional manufacturing step to allow a fillet for AOI (see The Value of Wettable Flank-plated QFN Packaging for Automotive Applications), but even then, some part of the copper can stay exposed.

Hi Clemens, Chirs,

Appreciate your support and feedback.

Let me call QFN terminal outline as a castle-shape terminal, for this case, I would like to get TI response about the fillet height risk (IPC-A-610 Chapter 8.3.4.6), the minimum fillet height shall be at least 25% or 50% of the sum of the solder thickness and the castellated hole height, if TI has any evaluation or verification data to explain this kind of exposed copper has no fillet height solderability risk?

Hi Wei, 

I will have to reach out to our packaging team. My team is the applications team and we help solve circuit problems and help assist in design. I will reach out to our packaging team to get their input and respond once I hear back. This will take some time to investigate. 

Best Regards, 
Chris Featherstone

These are not castellated terminations. QFN devices are bottom termination components; see section 8.3.13.