Part Number: OPA818
Regarding the input signal layout, the datasheet states the following:
“To reduce this unwanted capacitance, a plane cutout around and underneath the signal I/O pins on
all ground and power planes is recommended.”
We are designing a multilayer PCB. In this case, should the power and ground planes be removed on all layers underneath the input signal traces?
Or would it be sufficient to create the plane cutout only on the layer directly beneath the input signal traces?