Hello:
I'm looking to use the OPA1632DGN device on a project in a high-rel type of environment. I’m looking for the following information on this device:
- Thermal resistance junction to board?
- Thermal resistance junction to case?
- Max operating junction temperature?
Can you help me out with feedback on this? I don't see this information the device data sheet.
Any feedback or input is welcomed and appreciated!
Thanks again!
Paul